Signal Integrity Journal, March 12, 2019

EDI CON China 2019 Announces Innovation Award Finalists

Winners will be announced at the event on April 2 in Beijing.

EDI CON China 2019 taking place April 1-3, 2019 at the China National Convention Center in Beijing has announced the finalists in the second annual EDI CON China Product Innovation Awards.

The EDI CON China Product Innovation Awards honor the products introduced in the last year that have had the greatest impact on the industry, providing the tools necessary to bring on the next generation of electronic design Innovations. Winners will be announced at 10:00 on Tuesday, April 2 in the Frequency Matters Theater (in the exhibit hall at the China National Convention Center). All finalists will receive signs for display in their booths at EDI CON China 2019.

A panel of Microwave Journal and Signal Integrity Journal editors selected 15 finalists. Entries were judged on exceptional innovation, including consideration of product functionality, ease of use, cost effectiveness and other factors. The categories included Test & Measurement; Software/EDA; Semiconductors; Components, Cables & Connectors; and Materials, PCBs & Packaging.

EDI CON China offers congratulations to the engineers and companies who developed these notable products:

Components, Cables & Connectors Finalists:

  • TMY Technology Inc., Phase-locked oscillator
  • SAGE Millimeter, Ka Band Dual Polarized Choke Flange Feed Horn Antenna
  • Southwest Microwave, 1.0 mm Vertical Launch Compression-Mount PCB Connector