“The demand for micro sub-miniature push-on (SMPM) connectors to achieve ultra-high frequencies while decreasing system footprint continues to expand,” said Don Bradfield, Southwest Microwave General Manager and webinar presenter. “Unfortunately, these connectors – based on the sub-miniature push-on (SMP) connector design concept – often fail to meet electrical and structural performance needs.”
Southwest Microwave hosted an IMS Industry Talks virtual webinar, “Pushing Board-to-Board Interconnect Performance”, offering viewers these details on optimizing interconnect performance for board-to-board stacking applications:
- Understanding the various interface characteristics and the associated design and performance challenges
- Impact of engage and disengage forces
- Resolving challenges related to misalignment, number of engagements, insertion loss, VSWR and board damage