SSBB SuperMini Board-to-Board

SuperMini Board-to-Board solutions optimize interconnect performance for board-to-board stacking applications.

Available bullets enable board-to-board spacing as close as 3 mm, assuring transmission line dependability for tightly stacked PCBs. Low mating insertion force allows for an increased density of interconnections per board. Unique bullet design enables extended mating and de-mating cycles.